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Ultra-Thin Body Ge(110)-OI on Si fabrication from Ge/AlAs/GaAs Substrate via wafer bonding technology

Authors

Shim Jae Phil; KIM HANSUNG; Ju, Gunwu; Hyeong rak Lim; Kim Seong Kwang; Jae-Hoon Han; Sanghyeon Kim; Kim Hyung-jun

Publisher

2.5~7, 강원도 하이원리조트

Citation

한국반도체학술대회

Keywords

Ge; wafer bonding; ultra thin body

URI

https://pubs.kist.re.kr/handle/201004/87184

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KIST Conference Paper > Others

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