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dc.contributor.authorAnshuman Bhuyan-
dc.contributor.authorJung Woo Choe-
dc.contributor.authorLee, Byung Chul-
dc.contributor.authorIra Wygant-
dc.contributor.authorAmin Nikoozadeh-
dc.contributor.authorOmer Oralkan-
dc.contributor.authorButrus T. Khuri-Yakub-
dc.date.accessioned2024-01-12T14:35:38Z-
dc.date.available2024-01-12T14:35:38Z-
dc.date.created2021-09-29-
dc.identifier.urihttps://pubs.kist.re.kr/handle/201004/89452-
dc.languageEnglish-
dc.title3D volumetric ultrasound imaging with a 32×32 CMUT array integrated with front-end ICs using flip-chip bonding technology-
dc.typeConference-
dc.description.journalClass1-
dc.identifier.bibliographicCitationIEEE International Solid-State Circuits Conference Digest of Technical Papers 2013, pp.396 - 397-
dc.citation.titleIEEE International Solid-State Circuits Conference Digest of Technical Papers 2013-
dc.citation.startPage396-
dc.citation.endPage397-
dc.citation.conferencePlaceUS-
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