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Thermal conductivity of SiC/Nylon6,6 and hBN/Nylon6,6 composites

Authors

YU SEUNGGUN; Kim Do-Kyun; Yong Jin Kwon; Cheolmin Park; Hong, Soon Man; Koo Chong Min

Citation

한국고분자학회

URI

https://pubs.kist.re.kr/handle/201004/94038

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KIST Conference Paper > Others

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