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A new atomic layer deposition method and electrical performance of WN diffusion barrier for Cu nano via contact structures

Authors

Kim, Young-Hwan; Yeong-Hyeon Hwang; Won-Ju Cho; Kim, Yong Tae

Citation

European Materials Research Society (E-MRS), 2012

Keywords

WN; diffusion barrier; Cu nano via/contact; Atomic layer deposition

URI

https://pubs.kist.re.kr/handle/201004/95710

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KIST Conference Paper > Others

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