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Thermal Cycle Stability of Low Temperature(<650℃) Sealant for SOFCs

Other Titles

저온용(<650℃) SOFC 밀봉재의 조성 설계 및 열싸이클 특성 평가

Authors

Park Jeong Yong; yong chae chung; Lim Hyun Yub; Ji Ho Il; Kim, Hae-Ryoung; Son, Ji-Won; Lee, Jong Ho; Lee, Hae-Weon

Citation

한국세라믹학회

URI

https://pubs.kist.re.kr/handle/201004/96879

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KIST Conference Paper > Others

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