Full metadata record
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Yeong Hyeon Hwang | - |
| dc.contributor.author | Won-Ju Cho | - |
| dc.contributor.author | Kim, Young-Hwan | - |
| dc.contributor.author | Kim, Yong Tae | - |
| dc.date.accessioned | 2024-01-12T21:34:32Z | - |
| dc.date.available | 2024-01-12T21:34:32Z | - |
| dc.date.created | 2021-09-29 | - |
| dc.identifier.uri | https://pubs.kist.re.kr/handle/201004/97237 | - |
| dc.language | English | - |
| dc.subject | Cu via | - |
| dc.subject | Contact resistance | - |
| dc.subject | Thermal stability | - |
| dc.subject | WN | - |
| dc.subject | Diffusion barrier | - |
| dc.title | Thermal stability of Cu/WN/Si nano via contact structures | - |
| dc.type | Conference | - |
| dc.description.journalClass | 1 | - |
| dc.identifier.bibliographicCitation | Microprocesses and Nanotechnology Conference 2011, pp.p-11-58 | - |
| dc.citation.title | Microprocesses and Nanotechnology Conference 2011 | - |
| dc.citation.startPage | p-11-58 | - |
| dc.citation.conferencePlace | JA | - |
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