Showing results 11 to 18 of 18
Issue Date | Title | Author(s) |
---|---|---|
- | Technical improvement of FED tubeless packaging | Ju Byeong Kwon; 이덕중; 최우범; 정성재; LEE NAM YANG; 조경익; LEE YUN HI; 성만영; OH MYUNG HWAN |
- | Vacuum packaging of field emitter array using electrostatically-bonded glass-Si-glass/glass-glass structure | Ju Byeong Kwon; 이덕중; 정지원; Kim Hun; 이상조; LEE NAM YANG; 장진; OH MYUNG HWAN |
- | Vacuum sealing of field-emission arrays using field-assisted bonding method | 이덕중; Ju Byeong Kwon; LEE YUN HI; OH MYUNG HWAN; LEE NAM YANG; 한정인; 조경익; 장진 |
- | 전자선 증착된 실리콘 산화막 층을 이용한 직접 접합에 관한 연구 . | Ju Byeong Kwon; 박흥우; LEE YUN HI; 정성재; LEE NAM YANG; 고근하; M.R. Haskard; PARK JEONG HO; OH MYUNG HWAN |
- | (Undefined) | Ju Byeong Kwon; OH MYUNG HWAN; Jung Jae Hoon; 고창기; LEE NAM YANG; 김철주; 장진 |
- | (Undefined) | 고창기; Ju Byeong Kwon; 박흥우; Jung Jae Hoon; LEE NAM YANG; OH MYUNG HWAN; 김철주 |
- | (Undefined) | Ju Byeong Kwon; OH MYUNG HWAN; Jung Jae Hoon; 고창기; LEE NAM YANG; 김철주; 장진 |
- | (Undefined) | Jung Jae Hoon; Ju Byeong Kwon; 고창기; 박흥우; LEE NAM YANG; 장진; OH MYUNG HWAN |