Showing results 1 to 3 of 3
Issue Date | Title | Author(s) |
---|---|---|
1996-12 | A low temperature direct bonding method using an electron-beam evaporated silicon-oxide interlayer | 주병권; 이윤희; 오명환; H. W. Park; J. H. Park; N. Y. Lee; K. H. Koh; D. K. Shin; I. B. Kang; N. Samaan; M. R. Haskard |
1996-12 | A study on hermetic glass sealing using a modified direct bonding method | 주병권; 이윤희; 오명환; C. G. Ko; I. B. Kang; P. White; N. Samaan; M. R. Haskard |
1996-10 | An assembly and interconnection technology for micromechanical structure using a anisotropic conductive film | I. B. Kang; 주병권; M. R. Haskard |