Showing results 7 to 10 of 10
Issue Date | Title | Author(s) |
---|---|---|
- | Silicon to silicon anodic bonding using lithium doped interlayer | 정지원; Ju Byeong Kwon; 최우범; 정성재; LEE NAM YANG; CHOI DOO JIN; OH MYUNG HWAN |
- | Silicon-to-silicon electrostatic bonding using lithia-silicate glass interlayer | 정지원; Ju Byeong Kwon; CHOI DOO JIN; OH MYUNG HWAN |
- | Tubeless packaging of field emission display using glass to glass electrostatic bonding technology | 정지원; Ju Byeong Kwon; 이덕중; LEE YUN HI; N. Y. Lee; Y. W. Ko; Y. G. Moon; CHOI DOO JIN; OH MYUNG HWAN |
- | (Undefined) | 정지원; Ju Byeong Kwon; 최우범; 이덕중; CHOI DOO JIN; OH MYUNG HWAN |