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Silicon to silicon anodic bonding using lithium doped interlayer

Other Titles

리튬이 도핑된 막을 이용한 실리콘 - 실리콘 접합

Authors

정지원; Ju Byeong Kwon; 최우범; 정성재; LEE NAM YANG; CHOI DOO JIN; OH MYUNG HWAN

Citation

센서기술학술대회 논문집 , 서울대, pp.227 - 232

Keywords

MEMS; vacuum microelectronics; wafer bonding

URI

https://pubs.kist.re.kr/handle/201004/111320

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KIST Conference Paper > Others

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