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Showing results 7 to 10 of 10

Issue DateTitleAuthor(s)
-Silicon to silicon anodic bonding using lithium doped interlayer정지원; Ju Byeong Kwon; 최우범; 정성재; LEE NAM YANG; CHOI DOO JIN; OH MYUNG HWAN
-Silicon-to-silicon electrostatic bonding using lithia-silicate glass interlayer정지원; Ju Byeong Kwon; CHOI DOO JIN; OH MYUNG HWAN
-Tubeless packaging of field emission display using glass to glass electrostatic bonding technology정지원; Ju Byeong Kwon; 이덕중; LEE YUN HI; N. Y. Lee; Y. W. Ko; Y. G. Moon; CHOI DOO JIN; OH MYUNG HWAN
-(Undefined)정지원; Ju Byeong Kwon; 최우범; 이덕중; CHOI DOO JIN; OH MYUNG HWAN
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