Showing results 1 to 3 of 3
Issue Date | Title | Author(s) |
---|---|---|
- | Copper Electrodeposition for Semiconductor Interconnection | Soo-Kil Kim; Jae Jeong Kim |
- | Copper Interconnection for Microelectronics | Soo-Kil Kim; Jae Jeong Kim |
- | Morphological effect of electrodeposited Ni catalyst for hydrogen production by water electrolysis | Sang Hyun Ahn; Hwang Seung Jun; Insoo Choi; Yoo Sung Jong; Hyoung-Juhn Kim; Lim, Tae Hoon; Soo-Kil Kim; Jae Jeong Kim |