Copper Interconnection for Microelectronics

Authors
Soo-Kil KimJae Jeong Kim
Citation
International Conference on Microelectronics and Plasma Technology, pp.52
Keywords
Copper; Electrodeposition; Interconnection
URI
https://pubs.kist.re.kr/handle/201004/102577
Appears in Collections:
KIST Conference Paper > Others
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