Showing results 1 to 6 of 6
Issue Date | Title | Author(s) |
---|---|---|
2013-05 | Crack nucleation during mechanical fatigue in thin metal films on flexible substrates | Kim, Byoung-Joon; Shin, Hae-A-Seul; Jung, Sung-Yup; Cho, Yigil; Kraft, Oliver; Choi, In-Suk; Joo, Young-Chang |
2014-12-14 | Effect of film thickness on the stretchability and fatigue resistance of Cu films on polymer substrates | Kim, Byoung-Joon; Shin, Hae-A-Seul; Lee, Ji-Hoon; Yang, Tae-Youl; Haas, Thomas; Gruber, Patric; Choi, In-Suk; Kraft, Oliver; Joo, Young-Chang |
2012-11-05 | Fatigue-Free, Electrically Reliable Copper Electrode with Nanohole Array | Kim, Byoung-Joon; Cho, Yigil; Jung, Min-Suk; Shin, Hae-A-Seul; Moon, Myoung-Woon; Han, Heung Nam; Nam, Ki Tae; Joo, Young-Chang; Choi, In-Suk |
2014-03-28 | Improving mechanical fatigue resistance by optimizing the nanoporous structure of inkjet-printed Ag electrodes for flexible devices | Kim, Byoung-Joon; Haas, Thomas; Friederich, Andreas; Lee, Ji-Hoon; Nam, Dae-Hyun; Binder, Joachim R.; Bauer, Werner; Choi, In-Suk; Joo, Young-Chang; Gruber, Patric A.; Kraft, Oliver |
2012-04 | Microstructure Evolution and Defect Formation in Cu Through-Silicon Vias (TSVs) During Thermal Annealing | Shin, Hae-A-Seul; Kim, Byoung-Joon; Kim, Ju-Heon; Hwang, Sung-Hwan; Budiman, Arief Suriadi; Son, Ho-Young; Byun, Kwang-Yoo; Tamura, Nobumichi; Kunz, Martin; Kim, Dong-Ik; Joo, Young-Chang |
2018-07 | Reliability Issues and Solutions in Flexible Electronics Under Mechanical Fatigue | Yi, Seol-Min; Choi, In-Suk; Kim, Byoung-Joon; Joo, Young-Chang |