Showing results 1 to 9 of 9
Issue Date | Title | Author(s) |
---|---|---|
2016-12 | Cost-effective Fabrication of In0.53Ga0.47As-on-Insulator on Si for Monolithic 3D via Novel Epitaxial Lift-Off (ELO) and Donor Wafer Re-use | Kim, Seong Kwang; Shim, Jaephil; Geum, Dae-Myeong; Kim, Chang Zoo; Kim, Han-Sung; Kim, Yeon-Su; Kim, Sang Hyeon; Song, Jin Dong; Choi, Sung-Jin; Kim, Dae Hwan; Choi, Won Jun; Kim, Hyung-jun; Kim, Dong Myong; Kang, Hang-Kyu |
2017-09 | Fabrication of InGaAs-on-Insulator Substrates Using Direct Wafer-Bonding and Epitaxial Lift-Off Techniques | Kim, Seong Kwang; Shim, Jae-Phil; Geum, Dae-Myeong; Kim, Chang Zoo; Kim, Han-Sung; Song, Jin Dong; Choi, Sung-Jin; Kim, Dae Hwan; Choi, Won Jun; Kim, Hyung-Jun; Kim, Dong Myong; Kim, Sanghyeon |
2008-03 | Growth behavior and microstructure of oxide scales grown on WSi2 coating | Kim, Han-Sung; Yoon, Jin-Kook; Kim, Gyeung-Ho; Doh, Jung-Mann; Kwun, Sook-In; Hong, Kyung-Tae |
2009-12 | Heparin-Coated Gold Nanoparticles for Liver-Specific CT Imaging | Sun, In-Cheol; Eun, Dae-Kyung; Na, Jin Hee; Lee, Seulki; Kim, Il-Jin; Youn, In-Chan; Ko, Chang-Yong; Kim, Han-Sung; Lim, Dohyung; Choi, Kuiwon; Messersmith, Phillip B.; Park, Tae Gwan; Kim, Sang Yoon; Kwon, Ick Chan; Kim, Kwangmeyung; Ahn, Cheol-Hee |
2018-05 | Heterogeneous Integration Toward a Monolithic 3-D Chip Enabled by III-V and Ge Materials | Kim, Sang-Hyeon; Kim, Seong-Kwang; Shim, Jae-Phil; Geum, Dae-Myeong; Ju, Gunwu; Kim, Han-Sung; Lim, Hee-Jeong; Lim, Hyeong-Rak; Han, Jae-Hoon; Lee, Subin; Kim, Ho-Sung; Bidenko, Pavlo; Kang, Chang-Mo; Lee, Dong-Seon; Song, Jin-Dong; Choi, Won Jun; Kim, Hyung-Jun |
2018-05 | Impact of Ground Plane Doping and Bottom-Gate Biasing on Electrical Properties in In0.53Ga0.47As-OI MOSFETs and Donor Wafer Reusability Toward Monolithic 3-D Integration With In0.53Ga0.47As Channel | Kim, Seong Kwang; Shim, Jae-Phil; Geum, Dae-Myeong; Kim, Jaewon; Kim, Chang Zoo; Kim, Han-Sung; Song, Jin Dong; Choi, Sung-Jin; Kim, Dae Hwan; Choi, Won Jun; Kim, Hyung-Jun; Kim, Dong Myong; Kim, Sanghyeon |
2018-03 | Low-Temperature Material Stacking of Ultrathin Body Ge (110)-on-Insulator Structure via Wafer Bonding and Epitaxial Liftoff From III-V Templates | Shim, Jae-Phil; Kim, Han-Sung; Ju, Gunwu; Lim, Hyeong-Rak; Kim, Seong Kwang; Han, Jae-Hoon; Kim, Hyung-Jun; Kim, Sang-Hyeon |
2008-11 | Microstructure and oxidation behavior of in situ formed TaSi2-Si3N4 nanocomposite coating grown on Ta substrate | Yoon, Jin-Kook; Kim, Gyeung-Ho; Kim, Han-Sung; Shon, In-Jin; Kim, Jae-Soo; Doh, Jung-Mann |
2011-09 | Tumor-Targeting Gold Particles for Dual Computed Tomography/Optical Cancer Imaging | Sun, In-Cheol; Eun, Dae-Kyung; Koo, Heebeom; Ko, Chang-Yong; Kim, Han-Sung; Yi, Dong Kee; Choi, Kuiwon; Kwon, Ick Chan; Kim, Kwangmeyung; Ahn, Cheol-Hee |