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Showing results 1 to 7 of 7

Issue DateTitleAuthor(s)
2019-11Epitaxial Lift-Off Technology for Large Size III-V-on-Insulator SubstrateLee, Subin; Kim, Seong Kwang; Han, Jae-Hoon; Song, Jin Dong; Jun, Dong-Hwan; Kim, Sang-Hyeon
2018-10Heat Shunting by Innovative Source/Drain Contact to Enable Monolithic 3D Integration of InGaAs MOSFETsKim, SangHyeon; Kim, Seong Kwang; Shin, SangHoon; Han, Jae-Hoom; Grum, Dae-Myeong; Kim, Hyung-jun; Lee, Subin; Kim, Han Sung; Ju, Gunwu; Song, Jin Dong; Alam, Muhammad A.; Shim, Jae-Phil
2018-05Heterogeneous Integration Toward a Monolithic 3-D Chip Enabled by III-V and Ge MaterialsKim, Sang-Hyeon; Kim, Seong-Kwang; Shim, Jae-Phil; Geum, Dae-Myeong; Ju, Gunwu; Kim, Han-Sung; Lim, Hee-Jeong; Lim, Hyeong-Rak; Han, Jae-Hoon; Lee, Subin; Kim, Ho-Sung; Bidenko, Pavlo; Kang, Chang-Mo; Lee, Dong-Seon; Song, Jin-Dong; Choi, Won Jun; Kim, Hyung-Jun
2018-03Highly reproducible high-index-contrast distributed Bragg reflectors with an oxidized digital-alloy AlGaAsJu, Gunwu; Lee, Subin; Na, Byung Hoon; Kim, Hyung-Jun; Song, Young Min
2019-08Highly Stable Self-Aligned Ni-InGaAs and Non-Self-Aligned Mo Contact for Monolithic 3-D Integration of InGaAs MOSFETsKim, Sanghyeon; Kim, Seong Kwang; Shin, Sanghoon; Han, Jae-Hoon; Geum, Dae-Myeong; Shim, Jae-Phil; Lee, Subin; Kim, Hansung; Ju, Gunwu; Song, Jin Dong; Alam, M. A.; Kim, Hyung-Jun
2020-03Monolithic 3D Integration of InGaAs Photodetectors on Si MOSFETs Using Sequential Fabrication ProcessGeum, Dae-Myeong; Kim, Seong Kwang; Lee, Subin; Lim, Donghwan; Kim, Hyung-Jun; Choi, Chang Hwan; Kim, Sang-Hyeon
2018-08Simulation Study on the Design of Sub-kT/q Non-hysteretic Negative Capacitance FET Using Capacitance MatchingBidenko, Pavlo; Lee, Subin; Han, Jae-Hoon; Song, Jin Dong; Kim, Sang-Hyeon
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