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Showing results 1 to 8 of 8

Issue DateTitleAuthor(s)
-A low temperature direct bonding method using an electron-beam evaporated silicon-oxide interlayerJu Byeong Kwon; LEE YUN HI; OH MYUNG HWAN; H. W. Park; J. H. Park; N. Y. Lee; K. H. Koh; D. K. Shin; I. B. Kang; N. Samaan; M. R. Haskard
-A study on hermetic glass sealing using a modified direct bonding methodJu Byeong Kwon; LEE YUN HI; OH MYUNG HWAN; C. G. Ko; I. B. Kang; P. White; N. Samaan; M. R. Haskard
-An assembly and interconnection technology for micromechanical structure using a anisotropic conductive filmI. B. Kang; Ju Byeong Kwon; M. R. Haskard
-Emission characteristics of the Mo-coated silicon tipJu Byeong Kwon; OH MYUNG HWAN; H. W. Park; J. H. Jung; J. H. Park; I. J. Chung; M. R. Haskard
-Experimental analysis of the process of anodic bonding with an evaporated glass layer최우범; Ju Byeong Kwon; LEE YUN HI; S. J. Jeong; M. R. Haskard; LEE NAM YANG; 성만영; OH MYUNG HWAN
-Experimental analysis on the anodic bonding with evaporated glass layer최우범; Ju Byeong Kwon; LEE YUN HI; 정성재; LEE NAM YANG; 고근하; M. R. Haskard; 성만영; OH MYUNG HWAN
-Surface application of chromium silicide for improved stability of field emitter arraysJu Byeong Kwon; OH MYUNG HWAN; I. J. Chung; A. Hariz; M. R. Haskard
1995-03직접접합된 실리콘 기판쌍에 있어서 계면 산화막의 상태와 이의 새로운 평가방법 .주병권; 이윤희; 정회환; 정관수; D. B. Murfett; M. R. Haskard; 차균현; 오명환
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