DSpace at KISTKIST Conference PaperOthers

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dc.contributor.author진성언-
dc.contributor.author변동진-
dc.contributor.author이승무-
dc.contributor.authorJi Hun Park-
dc.contributor.author이도한-
dc.contributor.author최종문-
dc.contributor.author김창균-
dc.contributor.author정택모-
dc.date.accessioned2024-01-13T02:31:11Z-
dc.date.available2024-01-13T02:31:11Z-
dc.date.created2021-09-29-
dc.identifier.urihttps://pubs.kist.re.kr/handle/201004/101435-
dc.subjectCu-
dc.subjectCVD-
dc.subjectplasma-
dc.subjectagglomeration-
dc.subjectseed layer-
dc.title.alternativeCVD를 이용한 Cu 증착 시 plasma 전처리로 인한 구조적 특성의 비교 분석-
dc.typeConference-
dc.description.journalClass2-
dc.identifier.bibliographicCitation한국재료학회-
dc.citation.title한국재료학회-
dc.citation.conferencePlaceKO-
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