Wafer bonding between InP and Ce:YIG(CeY2Fe5O12) using O2 plasma surface activation for an integrated optical waveguide isolator

Authors
Roh Jong WookYANG, JEONG SU옥성해Woo, Deok HaByun, Young TaeJhon, Young MinT. MizumotoW. Y. LeeLee, Seok
Citation
PW2006 Photonics West, v.6123-44, pp.612316-1 - 612316-8
Keywords
Wafer bonding; integrated optical waveguide isolator; O2 plasma surface activation; GGG; Ce:YIG; photonic integrated circuits
URI
https://pubs.kist.re.kr/handle/201004/103668
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KIST Conference Paper > Others
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