Complete Prevention of Edge Bead Effect in Thick Photoresist for Cost-effective MEMS Process

Other Titles
MEMS process 비용 절감을 위한 두꺼운 포토레지스트에서 완전한 에지 비드 효과 방지
Authors
Lee, Byung ChulSung-Il ChangJun-Bo Yoon
Citation
제 8회 한국 MEMS 학술대회 논문집(2006년 4월 6-8일), pp.528 - 532
Keywords
Edge bead; Edge extension chuck; LIGA; MEMS; Photolithography; Spin coating; Thick photoresist
URI
https://pubs.kist.re.kr/handle/201004/104161
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KIST Conference Paper > Others
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