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dc.contributor.authorPARK JONG KOOK-
dc.contributor.authorKim, Sun Ho-
dc.contributor.authorJin Woo Park-
dc.contributor.authorByun, Young Tae-
dc.date.accessioned2024-01-13T08:33:44Z-
dc.date.available2024-01-13T08:33:44Z-
dc.date.created2021-09-29-
dc.identifier.urihttps://pubs.kist.re.kr/handle/201004/104810-
dc.languageEnglish-
dc.subject연마-
dc.subjectGaAs/Si3N4/SiO2/Si-
dc.subject웨이퍼의 접합력-
dc.titleDepending on Polishing Conditions of GaAs/Si3N4/SiO2/Si Wafers to Compare with Bonding Forces-
dc.title.alternative연마 조건에 따른 GaAs/Si3N4/SiO2/Si 웨이퍼의 접합력 비교-
dc.typeConference-
dc.description.journalClass2-
dc.identifier.bibliographicCitation한국광학회 2005년도 하계학술발표회, pp.46 - 47-
dc.citation.title한국광학회 2005년도 하계학술발표회-
dc.citation.startPage46-
dc.citation.endPage47-
dc.citation.conferencePlaceKO-
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