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Depending on Polishing Conditions of GaAs/Si3N4/SiO2/Si Wafers to Compare with Bonding Forces

Other Titles

연마 조건에 따른 GaAs/Si3N4/SiO2/Si 웨이퍼의 접합력 비교

Authors

PARK JONG KOOK; Kim, Sun Ho; Jin Woo Park; Byun, Young Tae

Citation

한국광학회 2005년도 하계학술발표회, pp.46 - 47

Keywords

연마; GaAs/Si3N4/SiO2/Si; 웨이퍼의 접합력

URI

https://pubs.kist.re.kr/handle/201004/104810

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KIST Conference Paper > Others

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