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dc.contributor.authorPARK JONG KUK-
dc.contributor.authorByun, Young Tae-
dc.contributor.authorKim, Sun Ho-
dc.contributor.authorJin Woo Park-
dc.date.accessioned2024-01-13T09:01:42Z-
dc.date.available2024-01-13T09:01:42Z-
dc.date.created2021-09-29-
dc.identifier.urihttps://pubs.kist.re.kr/handle/201004/104937-
dc.languageEnglish-
dc.subjectDirect wafer bonding-
dc.subjectHybrid device-
dc.subjectGaAs/SiO2/Si bonding-
dc.subjectSmart-cut process-
dc.subjectPECVD-
dc.titleDirect wafer bonding of GaAs/SiO2/Si for hybrid semiconductor optical devices-
dc.typeConference-
dc.description.journalClass1-
dc.identifier.bibliographicCitationThe 10th Optoelectronics and Communications Conference(OECC 2005), pp.670 - 671-
dc.citation.titleThe 10th Optoelectronics and Communications Conference(OECC 2005)-
dc.citation.startPage670-
dc.citation.endPage671-
dc.citation.conferencePlaceKO-
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