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Direct wafer bonding of GaAs/SiO2/Si for hybrid semiconductor optical devices

Authors

PARK JONG KUK; Byun, Young Tae; Kim, Sun Ho; Jin Woo Park

Citation

The 10th Optoelectronics and Communications Conference(OECC 2005), pp.670 - 671

Keywords

Direct wafer bonding; Hybrid device; GaAs/SiO2/Si bonding; Smart-cut process; PECVD

URI

https://pubs.kist.re.kr/handle/201004/104937

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KIST Conference Paper > Others

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