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Characteristics of Pulse Plasma Atomic Layer Deposited W-C-N Diffusion Barrier for Cu Interconnect

Authors

Kim, Yong Tae; Hyun Sang Sim; Park Ji Ho

Citation

The 206th Meeting of the Electrochemical Society in Honolulu

URI

https://pubs.kist.re.kr/handle/201004/105604

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KIST Conference Paper > Others

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