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Electromigration characteristics of Al/W-N/LOW-k/Si submicron interconnect structure

Authors

Kim, Yong Tae; yun Sang Sim; Kim, Seong Il

Citation

203rd Meeting of the Electrochemical Society, pp.no.718

URI

https://pubs.kist.re.kr/handle/201004/105935

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KIST Conference Paper > Others

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