DSpace at KISTKIST Conference PaperOthers

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dc.contributor.author박윤권-
dc.contributor.author김용국-
dc.contributor.authorKim Hun-
dc.contributor.authorLEE YUN HI-
dc.contributor.author김철주-
dc.contributor.authorJu Byeong Kwon-
dc.date.accessioned2024-01-13T13:02:58Z-
dc.date.available2024-01-13T13:02:58Z-
dc.date.created2021-09-29-
dc.identifier.urihttps://pubs.kist.re.kr/handle/201004/107144-
dc.languageEnglish-
dc.subjectThin 웨이퍼-
dc.subject패키징-
dc.subjectFBAR-
dc.titlePackaging of the MEMS devices using thin silicon wafer-
dc.title.alternativeThin 실리콘 기판을 이용한 MEMS 소자의 패키징-
dc.typeConference-
dc.description.journalClass2-
dc.identifier.bibliographicCitationSENSORS CONFERENCE 2002, pp.320 - 323-
dc.citation.titleSENSORS CONFERENCE 2002-
dc.citation.startPage320-
dc.citation.endPage323-
dc.citation.conferencePlaceKO-
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