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Packaging of the MEMS devices using thin silicon wafer

Other Titles

Thin 실리콘 기판을 이용한 MEMS 소자의 패키징

Authors

박윤권; 김용국; Kim Hun; LEE YUN HI; 김철주; Ju Byeong Kwon

Citation

SENSORS CONFERENCE 2002, pp.320 - 323

Keywords

Thin 웨이퍼; 패키징; FBAR

URI

https://pubs.kist.re.kr/handle/201004/107144

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KIST Conference Paper > Others

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