DSpace at KISTKIST Conference PaperOthers

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dc.contributor.author박흥우-
dc.contributor.author박윤권-
dc.contributor.author이덕중-
dc.contributor.author김철주-
dc.contributor.authorPARK JEONG HO-
dc.contributor.author서용교-
dc.contributor.author김정우-
dc.contributor.authorSONG CI MOO-
dc.contributor.authorOH MYUNG HWAN-
dc.contributor.authorJu Byeong Kwon-
dc.date.accessioned2024-01-13T14:30:28Z-
dc.date.available2024-01-13T14:30:28Z-
dc.date.created2021-09-29-
dc.identifier.urihttps://pubs.kist.re.kr/handle/201004/107787-
dc.languageEnglish-
dc.subjecthermetic-
dc.titleWafer level sealing technology of MEMS devices using B-stage epoxy-
dc.title.alternativeB-stage epoxy를 이용한 MEMS 소자의 웨이퍼 레벨 실장 기술-
dc.typeConference-
dc.description.journalClass2-
dc.identifier.bibliographicCitation제 3 회 MEMS 학술대회, pp.154 - 158-
dc.citation.title제 3 회 MEMS 학술대회-
dc.citation.startPage154-
dc.citation.endPage158-
dc.citation.conferencePlaceKO-
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