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Wafer level sealing technology of MEMS devices using B-stage epoxy

Other Titles

B-stage epoxy를 이용한 MEMS 소자의 웨이퍼 레벨 실장 기술

Authors

박흥우; 박윤권; 이덕중; 김철주; PARK JEONG HO; 서용교; 김정우; SONG CI MOO; OH MYUNG HWAN; Ju Byeong Kwon

Citation

제 3 회 MEMS 학술대회, pp.154 - 158

Keywords

hermetic

URI

https://pubs.kist.re.kr/handle/201004/107787

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KIST Conference Paper > Others

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