DSpace at KISTKIST Conference PaperOthers

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dc.contributor.author이유용-
dc.contributor.authorPARK YOUNG JOON-
dc.contributor.authorCho Byung Won-
dc.contributor.author이재봉-
dc.date.accessioned2024-01-13T15:00:42Z-
dc.date.available2024-01-13T15:00:42Z-
dc.date.created2021-09-29-
dc.identifier.urihttps://pubs.kist.re.kr/handle/201004/108061-
dc.languageEnglish-
dc.subjectCu interconnects-
dc.subjectsuperfilling-
dc.subjectelectroplating-
dc.titleEffects of current wave forms and current densities on the electroplated Cu interconnection in damascene plating-
dc.typeConference-
dc.description.journalClass2-
dc.identifier.bibliographicCitationProceedings of the 12th Asia Pacific Corrosion Control Conference, pp.122 - 132-
dc.citation.titleProceedings of the 12th Asia Pacific Corrosion Control Conference-
dc.citation.startPage122-
dc.citation.endPage132-
dc.citation.conferencePlaceKO-
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