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Effects of current wave forms and current densities on the electroplated Cu interconnection in damascene plating

Authors

이유용; PARK YOUNG JOON; Cho Byung Won; 이재봉

Citation

Proceedings of the 12th Asia Pacific Corrosion Control Conference, pp.122 - 132

Keywords

Cu interconnects; superfilling; electroplating

URI

https://pubs.kist.re.kr/handle/201004/108061

Appears in Collections:

KIST Conference Paper > Others

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