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Effect of microstructure on the coefficient of thermal expansion and young's modulus in tungsten-copper composites

Authors

LEE SEUNG ICK; Myung Ki You; 문인형

Citation

2000 Advances in Powder Metallurgy & Particulate Materials, pp.1 - 7

URI

https://pubs.kist.re.kr/handle/201004/108948

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KIST Conference Paper > Others

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