Full metadata record
DC Field | Value | Language |
---|---|---|
dc.contributor.author | D. J. Lee | - |
dc.contributor.author | Ju Byeong Kwon | - |
dc.contributor.author | OH MYUNG HWAN | - |
dc.contributor.author | LEE NAM YANG | - |
dc.contributor.author | 정성재 | - |
dc.contributor.author | 김관수 | - |
dc.contributor.author | 한정인 | - |
dc.contributor.author | J. Jang | - |
dc.date.accessioned | 2024-01-13T17:02:27Z | - |
dc.date.available | 2024-01-13T17:02:27Z | - |
dc.date.created | 2021-09-29 | - |
dc.identifier.issn | 0099-0966 | - |
dc.identifier.uri | https://pubs.kist.re.kr/handle/201004/109242 | - |
dc.language | English | - |
dc.subject | FED | - |
dc.subject | FEA | - |
dc.subject | MEMS | - |
dc.title | Characterization of tubeless packaged FED by glass-to-glass anodic bonding method | - |
dc.type | Conference | - |
dc.description.journalClass | 1 | - |
dc.identifier.bibliographicCitation | SID 99 Digest, pp.580 - 583 | - |
dc.citation.title | SID 99 Digest | - |
dc.citation.startPage | 580 | - |
dc.citation.endPage | 583 | - |
dc.citation.conferencePlace | US | - |
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