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dc.contributor.authorD. J. Lee-
dc.contributor.authorJu Byeong Kwon-
dc.contributor.authorOH MYUNG HWAN-
dc.contributor.authorLEE NAM YANG-
dc.contributor.author정성재-
dc.contributor.author김관수-
dc.contributor.author한정인-
dc.contributor.authorJ. Jang-
dc.date.accessioned2024-01-13T17:02:27Z-
dc.date.available2024-01-13T17:02:27Z-
dc.date.created2021-09-29-
dc.identifier.issn0099-0966-
dc.identifier.urihttps://pubs.kist.re.kr/handle/201004/109242-
dc.languageEnglish-
dc.subjectFED-
dc.subjectFEA-
dc.subjectMEMS-
dc.titleCharacterization of tubeless packaged FED by glass-to-glass anodic bonding method-
dc.typeConference-
dc.description.journalClass1-
dc.identifier.bibliographicCitationSID 99 Digest, pp.580 - 583-
dc.citation.titleSID 99 Digest-
dc.citation.startPage580-
dc.citation.endPage583-
dc.citation.conferencePlaceUS-
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KIST Conference Paper > Others
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