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Characterization of tubeless packaged FED by glass-to-glass anodic bonding method

Authors

D. J. Lee; Ju Byeong Kwon; OH MYUNG HWAN; LEE NAM YANG; 정성재; 김관수; 한정인; J. Jang

Citation

SID 99 Digest, pp.580 - 583

Keywords

FED; FEA; MEMS

ISSN

0099-0966

URI

https://pubs.kist.re.kr/handle/201004/109242

Appears in Collections:

KIST Conference Paper > Others

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