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Interconnect failure mechanism maps for different metallization materials and processes

Authors

V. K. Andleigh; PARK YOUNG JOON; C. V. Thompson

Citation

Materials Reliability in Microelectronics IX (Mat. Res. Soc. Symp. Proc. v.563), v.563, pp.59 - 64

Keywords

electromigration; reliability

URI

https://pubs.kist.re.kr/handle/201004/109499

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KIST Conference Paper > Others

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