직접접합과 전기화학적 식각정지법에 의한 SOI 기판 제작

Authors
Ju Byeong Kwon김일명이승준강경두정수태정귀상
Issue Date
1999-11
Citation
센서학회 종합학술대회, pp.355 - 358
Keywords
wafer bonding
URI
https://pubs.kist.re.kr/handle/201004/109537
Appears in Collections:
KIST Conference Paper > Others
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