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직접접합과 전기화학적 식각정지법에 의한 SOI 기판 제작

Authors

Ju Byeong Kwon; 김일명; 이승준; 강경두; 정수태; 정귀상

Issue Date

1999-11

Citation

센서학회 종합학술대회, pp.355 - 358

Keywords

wafer bonding

URI

https://pubs.kist.re.kr/handle/201004/109537

Appears in Collections:

KIST Conference Paper > Others

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