KIST Library Institutional Repository

Stress effect on interconnect reliability due to electromigration

Other Titles

반도체 배선의 electromigration 신뢰성에 미치는 stress의 영향

Authors

PARK YOUNG JOON; 주영창

Citation

Proc. of the Thirteenth Conference on Mechanical Behaviors of Materials, pp.83 - 92

Keywords

electromigration

URI

https://pubs.kist.re.kr/handle/201004/109562

Appears in Collections:

KIST Conference Paper > Others

Files in This Item:

There are no files associated with this item.

Export

RIS (EndNote)

XLS (Excel)

XML