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Fabrication of high-yield Si micro-diaphragms using electrochemical etch-stop in TMAH/IPA/pyrazine solution

Authors

Gwiy-Sang Chung; Chin-Sung Park; Ju Byeong Kwon

Citation

Conference on Device and Process Technologies for MEMS and Microelectronics, v.3892 (SPIE), pp.346 - 355

Keywords

anisotropic etching; TMAH/IPA/pyrazine solution; electrochemical etch-stop; OCP; PP; micro-diaphgarm

URI

https://pubs.kist.re.kr/handle/201004/109672

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KIST Conference Paper > Others

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