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Glass-to glass wafer anodic bonding and its application to FEA/FED micro-packaging

Authors

Ju Byeong Kwon; 이덕중; 정지원; OH MYUNG HWAN; 정성재; LEE NAM YANG; 고영욱; LEE CHOONG HOON; 한정인; 조경익; CHOI DOO JIN

Citation

IDRC '98, pp.145 - 148

Keywords

MEMS

URI

https://pubs.kist.re.kr/handle/201004/109935

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KIST Conference Paper > Others

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