Full metadata record
DC Field | Value | Language |
---|---|---|
dc.contributor.author | 정지원 | - |
dc.contributor.author | Ju Byeong Kwon | - |
dc.contributor.author | 최우범 | - |
dc.contributor.author | 이덕중 | - |
dc.contributor.author | CHOI DOO JIN | - |
dc.contributor.author | OH MYUNG HWAN | - |
dc.date.accessioned | 2024-01-13T19:01:41Z | - |
dc.date.available | 2024-01-13T19:01:41Z | - |
dc.date.created | 2021-09-29 | - |
dc.identifier.uri | https://pubs.kist.re.kr/handle/201004/110260 | - |
dc.subject | MEMS | - |
dc.title.alternative | 실리콘과 유리접합을 이용한 FED Packaging | - |
dc.type | Conference | - |
dc.description.journalClass | 2 | - |
dc.identifier.bibliographicCitation | 제5회 한국반도체학술대회 논문집, pp.207 - 208 | - |
dc.citation.title | 제5회 한국반도체학술대회 논문집 | - |
dc.citation.startPage | 207 | - |
dc.citation.endPage | 208 | - |
dc.citation.conferencePlace | KO | - |
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