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Other Titles

실리콘과 유리접합을 이용한 FED Packaging

Authors

정지원; Ju Byeong Kwon; 최우범; 이덕중; CHOI DOO JIN; OH MYUNG HWAN

Citation

제5회 한국반도체학술대회 논문집, pp.207 - 208

Keywords

MEMS

URI

https://pubs.kist.re.kr/handle/201004/110260

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KIST Conference Paper > Others

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