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FED Tubeless packaging by vacuum-electrostatic bonding

Other Titles

진공-정전 열 접합을 이용한 FED의 Tubeless Packaging

Authors

Ju Byeong Kwon; 이덕중; 정지원; 안준호; Kim Hun; OH MYUNG HWAN

Citation

제 9 회 센서기술학술대회 = The 9th Conference on Sensor Technology '98, pp.455 - 460

Keywords

MEMS

URI

https://pubs.kist.re.kr/handle/201004/110345

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KIST Conference Paper > Others

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