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New Vacuum packaging method of field emission display

Authors

Ju Byeong Kwon; 최우범; S. J. Jeong; LEE NAM YANG; J. I. Han; K. I. Cho; OH MYUNG HWAN

Citation

Proc. SPIE far east and pacific rim syomposium on smart materials, structures, and MEMS, Adelaide, A, v.3242, pp.?

Keywords

FED; wafer bonding; packaging

URI

https://pubs.kist.re.kr/handle/201004/111206

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KIST Conference Paper > Others

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