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dc.contributor.authorJu Byeong Kwon-
dc.contributor.author최우범-
dc.contributor.author이덕중-
dc.contributor.author정지원-
dc.contributor.author정성재-
dc.contributor.authorLEE NAM YANG-
dc.contributor.author조경익-
dc.contributor.author유형준-
dc.contributor.author한정인-
dc.contributor.authorOH MYUNG HWAN-
dc.date.accessioned2024-01-13T20:34:35Z-
dc.date.available2024-01-13T20:34:35Z-
dc.date.created2021-09-29-
dc.identifier.urihttps://pubs.kist.re.kr/handle/201004/111239-
dc.languageEnglish-
dc.subjectFED-
dc.subjectwafer bonding-
dc.subjecttubeless packaging-
dc.titleGlass-to-glass bonding for tubeless packaging of field emission display-
dc.title.alternativeFED의 Tubeless packaging을 위한 유리-유리 접합-
dc.typeConference-
dc.description.journalClass2-
dc.identifier.bibliographicCitation제1회 한국 정보디스플레이 학술대회 논문집, KIST, pp.123 - 124-
dc.citation.title제1회 한국 정보디스플레이 학술대회 논문집, KIST-
dc.citation.startPage123-
dc.citation.endPage124-
dc.citation.conferencePlaceKO-
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