KIST Library Institutional Repository

Glass-to-glass bonding for tubeless packaging of field emission display

Other Titles

FED의 Tubeless packaging을 위한 유리-유리 접합

Authors

Ju Byeong Kwon; 최우범; 이덕중; 정지원; 정성재; LEE NAM YANG; 조경익; 유형준; 한정인; OH MYUNG HWAN

Citation

제1회 한국 정보디스플레이 학술대회 논문집, KIST, pp.123 - 124

Keywords

FED; wafer bonding; tubeless packaging

URI

https://pubs.kist.re.kr/handle/201004/111239

Appears in Collections:

KIST Conference Paper > Others

Files in This Item:

There are no files associated with this item.

Export

RIS (EndNote)

XLS (Excel)

XML