Full metadata record
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | I. B. Kang | - |
| dc.contributor.author | Ju Byeong Kwon | - |
| dc.contributor.author | M. R. Haskard | - |
| dc.date.accessioned | 2024-01-13T21:30:34Z | - |
| dc.date.available | 2024-01-13T21:30:34Z | - |
| dc.date.created | 2021-09-29 | - |
| dc.identifier.uri | https://pubs.kist.re.kr/handle/201004/111527 | - |
| dc.language | English | - |
| dc.subject | MEMS | - |
| dc.subject | micromachining | - |
| dc.subject | wafer bonding | - |
| dc.title | An assembly and interconnection technology for micromechanical structure using a anisotropic conductive film | - |
| dc.type | Conference | - |
| dc.description.journalClass | 1 | - |
| dc.identifier.bibliographicCitation | SPIE 1996 symp. micromachining and microfabrication, Austin, Texas., pp.? | - |
| dc.citation.title | SPIE 1996 symp. micromachining and microfabrication, Austin, Texas. | - |
| dc.citation.startPage | ? | - |
| dc.citation.endPage | ? | - |
| dc.citation.conferencePlace | US | - |
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