An assembly and interconnection technology for micromechanical structure using a anisotropic conductive film

Authors
I. B. KangJu Byeong KwonM. R. Haskard
Citation
SPIE 1996 symp. micromachining and microfabrication, Austin, Texas., pp.?
Keywords
MEMS; micromachining; wafer bonding
URI
https://pubs.kist.re.kr/handle/201004/111527
Appears in Collections:
KIST Conference Paper > Others
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