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Study on physical properties of Cu-CVD for ULSI interconnects.

Authors

Kim Yong Tae; Y. S. Kim; S. K. Kwak; C. S. Kwon; D. G. Jung; Min Suk-Ki

Citation

한국물리학회 제 72 회 학술논문발표회, pp.?

URI

https://pubs.kist.re.kr/handle/201004/111587

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KIST Conference Paper > Others

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