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Heat Shunting by Innovative Source/Drain Contact to Enable Monolithic 3D Integration of InGaAs MOSFETs

Authors

Kim, SangHyeon; Kim, Seong Kwang; Shin, SangHoon; Han, Jae-Hoom; Grum, Dae-Myeong; Kim, Hyung-jun; Lee, Subin; Kim, Han Sung; Ju, Gunwu; Song, Jin Dong; Alam, Muhammad A.; Shim, Jae-Phil

Issue Date

2018-10

Publisher

IEEE

Citation

IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S)

ISSN

2573-5926

URI

https://pubs.kist.re.kr/handle/201004/114340

Appears in Collections:

KIST Conference Paper > 2018

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